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Precisely Controlled Anodic Etching for Processing of GaAs based Quantum Nanostructures and Devices

机译:基于GaAs的量子纳米结构和器件的精确控制阳极蚀刻。

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摘要

For controlled low-damage etching of AlGaAs/GaAs nanostructures, fundamental properties of an etching process consisting of anodic oxidation and subsequent oxide dissolution are investigated both theoretically and experimentally. Anodic oxides formed on GaAs (001) and (111)B surfaces have the same composition and the same anodization parameters according to XPS, SEM and AFM measurements. The same applies to those formed on Al0.3Ga0.7As (001) and (111)B surfaces. The etching depth can be precisely controlled in nanometer scale by the anodization voltage. Selective etching was realized, using the lithography patterns. The surface morphology is much better than that in the standard wet chemical etching.
机译:为了对AlGaAs / GaAs纳米结构进行可控的低损伤蚀刻,在理论和实验上研究了由阳极氧化和随后的氧化物溶解组成的蚀刻工艺的基本特性。根据XPS,SEM和AFM测量,在GaAs(001)和(111)B表面上形成的阳极氧化物具有相同的成分和相同的阳极氧化参数。在Al0.3Ga0.7As(001)和(111)B表面上形成的那些相同。可以通过阳极氧化电压以纳米级精确地控制蚀刻深度。使用光刻图案实现了选择性蚀刻。表面形态比标准的湿法化学蚀刻好得多。

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